AUTHORS: J. Zhang, J. Urbonas and G. Esposition, Maury Microwave; A. Arias-Purdue and P Rowell, Teledyne Technologies
PUBLICATION HISTORY: Microwave Journal – February 2021
ABSTRACT: The ability to benchmark the performance of semiconductor technologies using small periphery devices, quickly and accurately, can reduce development cost and expedite time to market. This can now be achieved using hybrid-active vector receiver load-pull measurements that enable E- and W-Band device characterization up to gamma magnitudes of 1 at the device-under-test (DUT) reference plane.