Enabling innovation and mass production
As chips operate at increasingly higher frequencies for applications like 5G, 6G, Wi-Fi 7, automotive radar, and satellite systems, precise RF characterization ensures design accuracy, signal integrity, and reliability.
Maury measurement and calibration solutions are crucial for accurate device modeling, process optimization, and quality assurance in today’s high-speed, high-frequency semiconductor landscape.
Maury solutions support:
- Precision measurement and modeling to ensure chips can handle high-speed, high frequency signals without failure.
- Verification that real world performance matches design expectations.
- Simulation for yield prediction and process optimization.
The most demanding modern semiconductor device manufacturers rely on Maury measurement and calibration solutions to power today’s high-speed wireless and data-intensive systems.
Learn more about Maury solutions for the semiconductor industry
Tuners that seamlessly integrate with on-wafer probe stations
Bring high-quality testing directly to the semiconductor wafer. Maury impedance tuners optimized for on-wafer probe station integration feature a compact size for a direct probe connection, effectively maximizing VSWR at the DUT reference plane and minimizing phase skew for modulated signals. Patented closed loop feedback motor control enhances measurement accuracy and repeatability.
Load pull for advanced designs
Load pull varies the load impedance to a DUT to observe its response and determine the parameters that enable the highest level of performance. Used to evaluate transistor performance, stress-test compact transistor models, extract DUT behavior models, design matching networks, and analyze DUT reliability, load pull is essential for characterizing nonlinear behavior in modern, high-performance systems.
No matter the load pull technique—whether passive scalar, harmonic, passive vector-receiver, active, hybrid-active, or mixed-signal active—Maury’s device characterization solutions empower semiconductor engineers to tune devices with precision, validate deigns across various impedance conditions, and extract performance insights that drive the next generation of wireless technology.
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Related Resources
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Overcoming the Challenges of On-Wafer Load Pull Measurements at Millimeter-Wave Frequencies for 5G Applications
This paper reviews the challenges of on-wafer load pull measurements at 5G mmW bands, specifically how high insertion losses can reduce the effectiveness of load pull and how to overcome these losses through the novel concept of hybrid-active load pull.
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